- Supported exchanges /
- TWO /
- 6147.TWO
Chipbond Technology (6147 TWO) stock market data APIs
Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and Mainland China. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; test services; and die processing services, such as wafer grinding/thinning,dicing, and tape-and-reel processes, as well as chip-on-film, chip on glass, chip-on-plastic, packaging attachment, and wafer level chip scale packaging services. It also provides compound semiconductors including SiGe, GaAs, GaN, SiC, and other wafers; flexible tape-and-reel circuit substrate; and chip tray. In addition, it develops, manufactures, packages, tests, sells, and after-sale services of integrated circuit and special materials for semiconductor; invests in, develops, manufactures, and sells electronic components; and manufactures and sale of elements. Chipbond Technology Corporation was incorporated in 1997 and is based in Hsinchu City, Taiwan.
Chipbond Technology Financial Data Overview
| 64.2 | |
| 64.3 | |
| - | |
| 64.7 | |
| 64 | |
| 59.5-80.8 | |
| 47 808 M | |
| 11.6304 | |
| 745 M | |
| 19 419 M | |
| 1.34 | |
| 0.529 |
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Chipbond Technology Fundamental Data is available in our Financial Data APIs
- Net Revenue 19 419 M
- EBITDA 6 011 M
- Earnings Per Share 5.52
- Income Statements
- Balance Sheets
- Cash flows
of Fundamental API Data
Get Chipbond Technology Earnings via APIs
- Latest Release 2024-07-26
- EPS/Forecast 0.92
Get Chipbond Technology End-of-day Data via APIs
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