BE Semiconductor Industries N.V. engages in the development, manufacture, marketing, sale, and service of semiconductor assembly equipment for the semiconductor and electronics industries in China, the United States, Malaysia, Ireland, Korea, Taiwan, Thailand, Other Asia Pacific and Europe, and internationally. It operates through three segments: Die Attach, Packaging, and Plating. The company's principal products include die attach equipment, such as single chip, multi-chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra-thin, and wafer level molding, as well as trim and form, and singulation systems. It also provides plating equipment, such as tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company's principal brand names include Datacon, Esec, Fico, and Meco. It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies. BE Semiconductor Industries N.V. was incorporated in 1995 and is headquartered in Duiven, the Netherlands.
| 96.5 | |
| 96.5 | |
| - | |
| 96.5 | |
| 96.5 | |
| 95-181.6959 | |
| 7 854 M | |
| 43.0804 | |
| 79 437 K | |
| 614 M | |
| 0.0215 | |
| 1.405 |
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Key Insights The projected fair value for BE Semiconductor Industries is €131 based on 2 Stage Free Cash Flow to Equity Current share price of €101 suggests BE Semiconductor Industries is potenti...
While BE Semiconductor Industries N.V. (AMS:BESI) shareholders are probably generally happy, the stock hasn't had particularly good run recently, with the share price falling 27% in the last quarter. ...
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