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LB Semicon Inc (061970 KQ) stock market data APIs
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
LB Semicon Inc Financial Data Overview
| 3415 | |
| 3385 | |
| - | |
| 3465 | |
| 3380 | |
| 3330-9630 | |
| 149 524 M | |
| 43 785 K | |
| 444 890 M | |
| -155.2781 | |
| 1.133 |
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LB Semicon Inc Fundamental Data is available in our Financial Data APIs
- Net Revenue 444 890 M
- EBITDA 82 699 M
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- Latest Release 2024-11-12
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