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Duksan Hi Metal Co.Ltd (077360 KQ) stock market data APIs

₩3800 -155(-3.9%) as of November 25, 2024
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Duksan Hi Metal Co.,Ltd manufactures and sells soldering materials for use in semiconductor packaging primarily in South Korea. The company offers solder ball, a semiconductor packaging technology that transmits electric signals by connecting chips and boards; solder paste, a substance for surface mounting technology and formation of flip chip bump, which solders technology as electronic component keep being developed; and solder powder, a substance of solder paste that is used for soldering PCBs and devices. The company also provides anisotropic conductive film (ACF) for directional electrical contact and chemical bonding, such as display, drive IC, PCB, etc.; conductive particle, a component of ACF that anisotropically controls electrical current; cored solder ball, which forms bumps between a substrate and a chip; low alpha tin for solving the problem of soft errors occurred in chips; silver nanowires; thermally conductive pastes; and EMI shielding pastes. The company was founded in 1999 and is headquartered in Ulsan, South Korea. Duksan Hi Metal Co.,Ltd is a subsidiary of DUKSAN group.

Duksan Hi Metal Co.Ltd Financial Data Overview

3955
3800
-
4280
3800
3725-8600
177 659 M
19 958 K
153 201 M
1.2962
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General: {
Code: '077360',
Type: 'Common Stock',
Name: 'Duksan Hi Metal Co.Ltd',
Exchange: 'KQ',
CurrencyCode: 'KRW',
CurrencyName: 'Korean Won',
CurrencySymbol: '₩',
CountryName: 'Korea',
CountryISO: 'KR',
OpenFigi: 'BBG000CY7HH8',
ISIN: 'KR7077360006',
CIK: NULL,
EmployerIdNumber: '',
FiscalYearEnd: 'December',
IPODate: '2005-10-14',
InternationalDomestic: 'International',
Sector: 'Technology',
Industry: 'Semiconductors & Semiconductor Equipment',
}

Duksan Hi Metal Co.Ltd Fundamental Data is available in our Financial Data APIs

  • Net Revenue 153 201 M
  • EBITDA 9 879 M
  • Earnings Per Share
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Get Duksan Hi Metal Co.Ltd Earnings via APIs

  • Latest Release 2024-11-12
  • EPS/Forecast NaN

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