Taiwan IC Packaging (3372 TWO) stock market data APIs
Taiwan IC Packaging Financial Data Overview
Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies. The company's products include thin small outline, small outline, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, quad flat, LQFP, thermal enhanced, and image sensor packages. It also offers substrate-based package products, such as LGA, VLGA, micro-SD cards, and SD cards. Taiwan IC Packaging Corporation was founded in 1998 and is headquartered in Kaohsiung, Taiwan.
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Get Taiwan IC Packaging Fundamental Data
Taiwan IC Packaging Fundamental data includes:
- Net Revenue: 915 M
- EBITDA: -76 001 000
- Earnings Per Share:
- Income Statements
- Balance Sheets
- Cash flows
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- Latest Release: 2025-06-12
- EPS/Forecast: NaN
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