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Winbond Electronics Corp (2344 TW) stock market data APIs

NT$170.5975 -2.69(-1.6%)
as of June 12, 2026
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Winbond Electronics Corp Financial Data Overview

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ISIN: TW000234**** The data is available with plans that include the Fundamentals API. Check our pricing page for details.

Winbond Electronics Corporation engages in the research, development, production and sales of integrated circuits, various semiconductor components and other system products. The company offers customized memory solutions, including CUBE(3DCaaS), pseudo static random access memory, DDR/SDR, LPDDR/LPSDR, Known Good Die wafer products; electrical simulation, wafer-level speed testing, and other services; redistribution layers; and failure analysis services, as well as low power SDR, DDR, DDR2, DDR3, and DDR4/4X SDRAM products. It also provides specialty DRAM products, such as SDRAM, DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, and DDR4 SDRAM products; code storage flash memory products comprising serial NOR, 1.2V serial NOR, octal NOR, QspiNAND, OctalNAND, SLC NAND, NAND based MCP, SpiStack, and authentication flash products; TrustME secure flash memory, such as secure flash memory, and secure memory elements; and logic IC products. In addition, the company is involved in the research, development, design, sale, and after-sales service of semiconductors and 6-inch wafer fab production, testing, and foundry services; E-commerce and investment business; semiconductor component design and marketing services; smart factory solutions; semiconductor-related hardware and software system integration design; design, research, testing, sales, and service of integrated circuits and auxiliary equipment; develops automotive and industrial control software and services; customer service and technical support; computer software services; computers and peripherals, and software wholesale; repair, testing, and related technical consulting services; and rental of semiconductor-related equipment. It markets its products through distributors and online. The company's products are used in computer, communication, consumer, automotive, and industrial electronics. Winbond Electronics Corporation was incorporated in 1987 and is headquartered in Taichung, Taiwan.

Prev. Close 170.5975
Open 167.9098
High 170.7331
Low 166.4605
52 wk Range 16.4141-193
Market Cap 774 000 M
P/E Ratio 195.4545
Shares Outstanding 4 500 M
Revenue 107 667 M
EPS 2
Dividends (Yield) 0.0032
Beta 1.919

* We provide hundreds of fields of fundamental data, including EBITDA, P/E ratio, PEG ratio, trailing P/E, shareholders, insider transactions, technical metrics, dividends, splits, earnings, and more. Check out our Fundamental Data API.


ETFs with Winbond Electronics Corp (top by weight)

Ticker
100-day Price Change
Weight
00947.TW Taishin Taiwan IC Design and Momentum ETF
14.27 (62.64%)
7.54
HBGD-U.TO Global X Big Data & Hardware Index ETF
21.37 (58.56%)
4.35
DRAM.US Roundhill Memory ETF
65.01
1.84
PIE.US Invesco DWA Emerging Markets Momentum ETF
6.53 (25.06%)
1.76
EMSC.US Sophus Capital Emerging Market Small Cap ETF
26.55
1.57
ISFE.AS iShares VII PLC - iShares Core FTSE 100 ETF GBP Acc EUR
0.26 (0.12%)
1.33
HESC.SW HSBC MSCI Emerging Markets Small Cap ESG UCITS ETF USD Acc USD
3.13 (11.24%)
1.30
H41F.XETRA HSBC MSCI Emerging Markets Small Cap ESG UCITS ETF USD Acc EUR
2.82 (11.79%)
1.30

* We provide detailed information about ETF constituents through our Fundamentals API for ETFs. Read the documentation to learn more.


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Winbond Electronics Corp Fundamental data includes:

  • Net Revenue: 107 667 M
  • EBITDA: 30 979 M
  • Earnings Per Share: 0
  • Income Statements
  • Balance Sheets
  • Cash flows

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  • Latest Release: 2026-05-05
  • EPS/Forecast: 1.9
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