Kinsus Interconnect Technology Corp., together with its subsidiaries, engages in the manufacture and sale of electronic products in Taiwan and internationally. The company offers system in package, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for modules in handset and wearable devices; plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. It also provides wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and Wi-Fi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company is involved in the research, development, production, and sale of electronic components, and printed circuit boards and related products, as well as provision of after sales services; manufacture, production, and sale of medical equipment; and sale of cosmetic products. Further, it is involved in the wholesale and retail-sale of electronic materials; manufacture and sale of medical equipment; provision of consultation services for business operation and management; investment and trading activities; and sale of cosmetic products. Additionally, the company produces, manufactures, and sells contact lens. It primarily serves manufacturers of electronic products. The company was incorporated in 2000 and is based in Taoyuan City, Taiwan.
| 96 | |
| 97.3 | |
| - | |
| 97.8 | |
| 95.9 | |
| 88.1-132 | |
| 43 840 M | |
| 65.7534 | |
| 457 M | |
| 29 981 M | |
| 0.41 | |
| 0.988 |
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