Zen Voce (3581 TWO) stock market data APIs

Zen Voce Corporation manufactures, processes, maintains, and sells semiconductor packaging and testing equipment and fixtures in Taiwan, the United States, China, Singapore, and internationally. The company engages in the design and manufacturing of equipment, including IC packaging machines and bumping products, wafer cutting and cleaning machines, and board cutting and cleaning machines; and test products, such as wafer test probe card PCBs, IC test HIFIX and CHANG kits, SOCKET IC test products, IC handlers, and SOCKET IC burn-in test products. It also offers wafer and packaging dicing equipment, solder ball mounting equipment, consumables and accessories, logical and memory applications, and burn-ins; and optoelectronic assembly testing products. In addition, the company acts as an agent for semiconductor burn-in test connectors, MEMS equipment, solar equipment, and LCD inspection equipment. It exports its products. The company serves semiconductor, optoelectronics, microelectronics, and LCD equipment industries. Zen Voce Corporation was founded in 1999 and is headquartered in Hsinchu City, Taiwan.