Techbond Group Bhd (5289 KLSE) stock market data APIs

RM0.3292 0(0%)
as of July 11, 2025
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Techbond Group Bhd Financial Data Overview

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Techbond Group Berhad develops, manufactures, and trades in industrial adhesives and sealants in Malaysia, Vietnam, Indonesia, China, and internationally. The company offers industrial adhesives, including water-based and hot melt adhesives; and industrial sealants, such as water-based and solvent-based sealants. It also provides products and services comprising original equipment manufacturer, industrial adhesives, adhesive repellents and cleaners, chemicals, and as well as adhesive blending machines; and cleaners, spare parts, and maintenance services. In addition, the company offers wood adhesives, formalin, phenolic resins, dry resins, and microspheres. Techbond Group Berhad serves woodworking, paper, packaging, automotive, building and construction, personal care, cigarette, and mattress sectors. It also exports its products. The company was founded in 1992 and is headquartered in Shah Alam, Malaysia. Techbond Group Berhad is a subsidiary of Sonicbond Sdn. Bhd.

Prev. Close 0.3292
Open 0.3292
High 0.3326
Low 0.3279
52 wk Range 0.265-0.5462
Market Cap 250 M
P/E Ratio 11
Shares Outstanding 759 M
Revenue 151 M
EPS 0.0059
Dividends (Yield) 0.0763
Beta 0.221

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Techbond Group Bhd Fundamental data includes:

  • Net Revenue: 151 M
  • EBITDA: 25 855 K
  • Earnings Per Share: 0
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  • Latest Release: 2025-05-29
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