Powertech Technology Inc., together with its subsidiaries, researches, designs, develops, assembles, manufactures, packages, tests, and sells various integrated circuit (IC) products in Taiwan, Japan, Singapore, the United States, Europe, China, Hong Kong, Macao, and internationally. It provides chip probing and final test; IC packaging services, such as wafer level packing, flip chips, wire bond BGA, lead frame, and system in package; and module assembly services. The company is also involved in the design, manufacturing, assembly, testing, and sale of semiconductors; metal surface treatment on semiconductor wire frame; and metal plating on semiconductor lead frame, as well as investment and wafer probing testing activities. Powertech Technology Inc. was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.
| 125 | |
| 125.5 | |
| - | |
| 127 | |
| 125 | |
| 107.5-209.5 | |
| 93 418 M | |
| 10.1874 | |
| 747 M | |
| 75 251 M | |
| 2.28 | |
| 0.722 |
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